Use of monocrystalline silicium as a tool material in the cutting processes of thin sheets
The machining of thin sheets for the manufacture of metal components (e.g. lithium-polymer battery cases) with a thickness of up to a few 100µm using stamping is well-known. Steel or ceramics are used as a material for tools (stamps). This project aims to develop high-precision stamps with the help of microsystems technology for the mass-production of stamped sheets with a thickness of only a few µm. The manufacture of high-precision silicium stamps is made possible by using advanced etching technologies. The silicium technology also enables a targeted use of the surface characteristics (roughness) and surface contours (cutting edge) of the stamp. In order to increase the life of the silicium stamp, it can be treated with a resistant coating such as LPCVD Si3N4 or SiC. Critical questions in the project are the adhesive qualities of the resistant coating on silicium and the slant of the cutting edge. With the slant of the cutting edge of the tool it is possible to improve the cutting quality in order to produce high quality micro-components.
Furtwangen University, IAF (Silicium stamp, characterisation)Friedrich-Alexander-Universität Erlangen-Nürnberg, LFT (Test set-up, stamping testing, characterization)
Prof. Dr. Ulrich Mescheder